Chinese chipmaker Taiwan Semiconductor Manufacturing Co. (TSMC) has developed the most patents surrounding advanced chip packaging, followed by Samsung Electronics and then Intel, according to data from LexisNexis. TSMC has 2,946 advanced packaging patents.
The Judicial Court of Paris invalidated two Nokia implementation patents (EP 1704731; EP 1702486), finding they are both invalid for lack of novelty, a decision that stands in contrast to other decisions on the same patents in Europe, according to news by JUVE Patent on July 31.
On July 14, Chinese drone maker DJI Technology filed a patent infringement lawsuit against Textron in the US District Court for the Eastern District of Virginia, accusing Textron of infringing four of its US patents involving the control, communications and navigation of drones.
On July 11, the second WIPO Global Awards ceremony was held in Geneva, Switzerland. Among the seven award-winning companies from around the world include two Chinese companies: Shanghai Westwell Technology, which develops multi-scenario smart and green logistics solutions.
On July 4, the European Patent Office (EPO) officially announced that Wu Kai, the chief scientist of CATL, and his team have won the European Inventor Award 2023 for the “Non-EPO countries” from more than 600 candidates.
